FACULTY OF ELECTRICAL ENGINEERING AND INFORMATION TECHNOLOGY

PROF. DR. MARTIN HOFFMANN, MICROSYSTEMS TECHNOLOGY

The group uses different plasmas for deposition and etching of microsystems and microelectronics. It hosts the “Forschungslabor Mikroelektronik Bochum für 2D-Elektroniksysteme”, funded by BMBF within the ForLab initia-tive. The technological backbone are a three-chamber cluster tool for physical vapour deposition (PVD) and a five-chamber cluster tool for plasma-based CVD including atomic layer deposition (ALD) and reactive ion etching (RIE) / atomic layer etching (ALE). Both clusters are installed in 2021 and are open for research cooperation. The key research topics are microelectronics based on 2D-materials (new materials, selective etching of 2D-materials, process integration) and innovative microsystems in silicon and in glasses based on reactive ion etching. All pro-cesses are available on wafer scale (silicon and glass) up to 200 mm diameter.

Keywords: plasma deposition, plasma etching, electronic systems, microsystems

Webpage: Microsystem technology